ARM servers offer the promise of lower power consumption, greater scalability, and simpler transitions to smaller dimension processes. In data centers, they are particularly well-suited to handling memory intensive web-scale workloads, big data, in-memory database computing, real-time data analysis, cloud computing, and storage and networking applications.
Santa Clara, CA, United States, April 13, 2016 — Applied Micro Circuits Corporation (NASDAQ: AMCC), a global leader in computing and connectivity is set to make a major new product announcement at Open Server Summit (OSS). The announcement will be made during the company’s keynote address scheduled from 2:30 to 3:00 PM on Thursday April 14. The keynote will held in the Great America Ballroom J/K. Until this announcement, ARM servers were held back from achieving the promise. The lack of 64-bit processors held them back from achieving the desired results. The newly launched AppliedMicro flagship processor, the X-Gene 3, now removes this roadblock and opens up a wide range of applications for future data centers in the era of cloud computing.
Applied Micro has made major recent announcements on 100G and 400G Ethernet at the Optical Fiber Communication Conference and Exposition (OFC). They also demonstrated an Open Compute Project (OCP) solution X-Gene® Server-on-a-Chip® on a 64-bit ARM chip at OCP on March 10. Earlier in the year, AppliedMicro partnering with Theobroma Systems, announced that the optimized HeliX™ 2 COM Express Module would be set for production debut in the second quarter of 2016. Theobroma provided software engineering expertise and performance tuning for ARM®v8 on its X-Gene® platforms.
The HeliX 2 COM Express Development Platform has been released through both AppliedMicro’s and Theobroma’s distribution channels. The design documentation for the new product will be made available as a reference design to AppliedMicro’s customers through myAPM.com. The new solution features 10 Gigabit Ethernet and 1 Gigabit Ethernet network interfaces, PCI Express® Gen 3 Expansion. The platform also includes SATA 3 for enterprise-grade mass storage connectivity, USB 2.0 for connecting standard peripherals, a slot for an “intelligent HMI module”, and a variety of embedded interfaces.
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