Atomic layer deposition is a deposition technique capable of producing thin films of a variety of materials. Majority of the reactions taking place in the atomic layer deposition use multiple chemicals called precursors that react with the surface of a material in a sequential manner. Key applications of atomic layer deposition include electronic displays, optical data storage devices, electronic components, and the biomedical field. Atomic layer deposition offers several advantages and disadvantages over conventional techniques, such as physical vapor deposition (PVD) and chemical vapor deposition (CVD) techniques, due to its conformality and control over the material’s thickness and composition.
This deposition technique provides a controlled method to produce a film of specified thickness. Atomic layer deposition is beneficial in the field of nanotechnology and microelectronics to produce small and efficient semiconductors. However, atomic layer deposition instruments are expensive, and prices are based on the efficiency and quality of the instrument. Additionally, it is important to select a suitable substrate for use in microelectronics. These substrates are difficult to obtain and can be expensive.
Growth in the end-user industries is expected to boost the demand for atomic layer deposition instruments. The electronics industry is growing at a rapid rate, especially in the emerging economies of Asia Pacific and Latin America. This is expected to fuel the demand for atomic layer deposition instruments. Additionally, rising demand for miniaturized components and development of nanotechnology is anticipated to propel the demand for atomic layer deposition instruments. Semiconductor industries are likely to invest in new manufacturing equipment, and the market is expected to witness major opportunities in the near future.
Atomic layer deposition instruments are expensive as compared to conventional techniques. Substrates used in atomic layer deposition instruments are also difficult to obtain when compared to conventional techniques. This is projected to hamper the growth of the market to a certain extent. Furthermore, the deposition rate of atomic layer deposition is slower, which could pose a challenge to its market growth. Additionally, the industry is capital intensive in nature, and investment usually occurs during periods of major technology developments.
Europe, North America, and Asia Pacific account for majority of the atomic layer deposition market. Europe has the largest market share followed by North America and Asia Pacific in the overall atomic layer deposition market. India and China are expected to be the major markets for atomic layer deposition in Asia Pacific due to the presence of established end-user industries. Major semiconductor manufacturers are shifting their production facilities from developed economies to emerging economies of Asia Pacific due to the presence of cheap land, government subsidies, and skilled labor. Hong Kong, Australia, New Zealand, Republic of Korea, Japan, Vietnam, Malaysia, and Indonesia are anticipated to be the other major markets in Asia Pacific.
The market is dominated by large and medium electronic manufacturing companies. Key players operating in this market include AIXTRON SE (Germany), ATMI, Inc. (the U.S.), Air Liquide S.A. (France), Applied Materials, Inc. (the U.S.), Beneq (Finland), Encapsulix SAS (France), Kurt J. Lesker Company (the U.S.), Tokyo Electron Ltd. (Japan), Ultratech, Inc. (the U.S.), ASM International N.V. (the U.S.), Adeka Corporation (Japan), Air Products and Chemicals, Inc. (the U.S.), Arradiance, Inc. (the U.S.), Centrotherm Photovoltaics AG (Germany), Hitachi Kokusai Electric Inc. (Japan), Tosoh Corporation (Japan), and Veeco Instruments, Inc. (the U.S.). Companies are entering into strategic acquisitions and mergers to increase their market share. Additionally, companies are using aggressive marketing tactics and investing in research and development to remain competitive in the market.